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Core Capability

Electronic Packaging

Spaceflight-ready RF, high-voltage, and hybrid microelectronics packaging

Overview

Sierra Lobo provides RF, high-voltage, and hybrid microelectronics packaging design, including PCB/PWB development and fabrication, electronic chassis and assembly design, thermal and structural analysis, and end-to-end harness design, build, and test support.

Key Features & Methodologies

PCB/PWB Development

Design and fabrication support for printed circuit and printed wiring boards.

Electronic Chassis Design

Mechanical and electrical packaging for assemblies exposed to demanding environments.

Thermal & Structural Analysis

Analysis-led packaging to address heat, vibration, and structural constraints.

Harness Support

End-to-end harness design, build, and test capabilities.

Common Applications

  • RF Electronics
  • High-Voltage Systems
  • Hybrid Microelectronics
  • Harness Assemblies

Strategic Benefits

  • Ruggedized
    Packaging designed for spaceflight and test environments
  • Analyzed
    Thermal and structural constraints built into the design process
  • Complete
    Design, fabrication, assembly, and test support from one team

Need a custom solution?

Our engineering team can tailor analysis workflows to your specific mission constraints.

Contact Engineering →